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Ultraviolet laser precision machining system Direc

  • Product time:2020-06-10
  • Brief description:Due to the high absorption rate of various materials for ultraviolet lasers, ultraviolet processing has a wide range of material processing suitability. Non-contact processing is used for processing, and there are no defects caused by mechanical stress.
Detailed introduction

Ultraviolet laser precision machining system DirectLaser S5 uses an ultraviolet laser, which uses ultraviolet laser to cut and remove materials, and has the following characteristics
1. Due to the high absorption rate of various materials for ultraviolet laser, ultraviolet processing has a wide range of material processing applicability
2. The processing adopts non-contact processing without defects caused by mechanical stress.
3. The high energy characteristic of ultraviolet laser can directly destroy molecular chains or atomic bonds, and has the characteristics of low heat and small influence area
4. Short wavelength, can achieve a smaller spot, can process smaller holes or slits.

5. Semiconductor pumped solid-state laser, high conversion efficiency, low system power consumption, more environmentally friendly.


Technical Parameters
DirectLaser S5
Host size (width x height x thickness)
1250x1800x1650mm
Processing range
500x520mm
Resolution
1um
Repeat accuracy
±2um
Laser model
Awave
Laser class
Level 1
Output Power 
17W@ 30KHz
wavelength
355nm
power supply
380V/16A, 50Hz
Power supply
3KW
Fan power
1.5KW
Flow
200 m^3 /h
Vacuum cleaner size (width x height x thickness)
470x1000x480mm

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